Date of Award

8-17-2017

Document Type

Thesis

Department

Electrical Engineering

First Advisor

James Morris

Subjects

Interconnects (Integrated circuit technology), Three-dimensional integrated circuits, Carbon nanotubes -- Thermal properties

DOI

10.15760/honors.471

Abstract

This paper outlines the electrical and thermal properties of carbon nanotubes (CNT) as a potential replacement for Copper (Cu) in through silicon vias (TSV). Cu has undesirable thermal properties, and CNTs could resolve issues that high density interconnects experience under high thermal loads around 100 C. Most notably, the coefficient of thermal expansion for CNTs is two orders of magnitude lesser than Cu [1]. The electrical and mechanical properties of CNTs under a high frequency load of 1 THz, and high thermal load of 100 C are simulated with ABAQUS 6.16. There is no observable skin effect modelled for the Cu or Single-Walled Carbon Nanotube (SWCNT) wires simulated in this paper.

Comments

An undergraduate honors thesis submitted in partial fulfillment of the requirements for the degree of Bachelor of Science in University Honors and Electrical Engineering

Persistent Identifier

http://archives.pdx.edu/ds/psu/21082

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