Published In
Journal of Materials Science: Materials in Electronics
Document Type
Article
Publication Date
12-2015
Subjects
Thermal stresses, Microelectronic packaging -- Materials, Plasticity, Deformations (Mechanics), Ball grid array technology
Abstract
A simple, easy-to-use and physically meaningful predictive model is suggested for the assessment of thermal stresses in a ball-grid-array or a column-grid-array with a low modulus solder material at the peripheral portions of the assembly. It is shown that the application of such a design can lead to a considerable relief in the interfacial stresses, even to an extent that inelastic strains in the solder joints could be avoided. If this happens, the fatigue strength of the bond and of the assembly as a whole will be improved dramatically: low-cycle fatigue conditions will be replaced by the elastic fatigue condition, and Palmgren–Minor rule of linear accumulation of damages could be used instead of one of the numerous Coffin–Manson models to assess the lifetime of the material.
DOI
10.1007/s10854-015-3635-6
Persistent Identifier
http://archives.pdx.edu/ds/psu/17014
Citation Details
Ephraim, S. and Ghaffarian, R. (2015). Predicted Stresses in a Ball-Grid-Array (BGA)/Column-Grid-Array (CGA) Assembly with a Low Modulus Solder at its Ends. Journal of Materials Science: Materials in Electronics, Volume 26, Issue 12, pp 9680-9688.
Description
This work was authored as part of the Contributor's official duties as an Employee of the United States Government and is therefore a work of the United States Government. In accordance with 17 U.S.C. 105, no copyright protection is available for such works under U.S. Law. This is the publisher’s final pdf. The published article is copyrighted by Springer Science+Business Media and can be found at: http://dx.doi.org/10.1007/s10854-015-3635-6