Document Type

Closed Project

Publication Date

Spring 1994


Richard F. Deckro

Course Title

Total Quality Management II

Course Number

EMGT 510


This Project is to reduce the yield loss realized at In-circuit testing for surface mount solder defects to less tan 1% in Intel Products Group. The team completed: Reviewed the existing surface mount Process, process operating procedures, and process controls; reviewed data from the process measurement system and evaluated the effect of the variation within the measurement system has on the process control system. The conclusion is that the process measurement system presently used to monitor the solder height has too much variation within the measurement process to effectively be used as a process control tool.


This project is only available to students, staff, and faculty of Portland State University.

Persistent Identifier