Document Type

Closed Project

Publication Date

Spring 1994

Instructor

Richard F. Deckro

Course Title

Total Quality Management II

Course Number

EMGT 510

Abstract

This Project is to reduce the yield loss realized at In-circuit testing for surface mount solder defects to less tan 1% in Intel Products Group. The team completed: Reviewed the existing surface mount Process, process operating procedures, and process controls; reviewed data from the process measurement system and evaluated the effect of the variation within the measurement system has on the process control system. The conclusion is that the process measurement system presently used to monitor the solder height has too much variation within the measurement process to effectively be used as a process control tool.

Rights

In Copyright. URI: http://rightsstatements.org/vocab/InC/1.0/ This Item is protected by copyright and/or related rights. You are free to use this Item in any way that is permitted by the copyright and related rights legislation that applies to your use. For other uses you need to obtain permission from the rights-holder(s).

Comments

This project is only available to students, staff, and faculty of Portland State University.

Persistent Identifier

http://archives.pdx.edu/ds/psu/24172

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