Richard F. Deckro
Total Quality Management II
This Project is to reduce the yield loss realized at In-circuit testing for surface mount solder defects to less tan 1% in Intel Products Group. The team completed: Reviewed the existing surface mount Process, process operating procedures, and process controls; reviewed data from the process measurement system and evaluated the effect of the variation within the measurement system has on the process control system. The conclusion is that the process measurement system presently used to monitor the solder height has too much variation within the measurement process to effectively be used as a process control tool.
Alvarez, John J.; Buescher, Edward; Knoben, Knoben; Rak, Thomas; Rivera, Fernando; and Uslu, Akin, "Defect Reduction for Screen Printing" (1994). Engineering and Technology Management Student Projects. 1253.