Dundar F. Kocoaglu
Operations Research in Engineering Management
This report describes a linear programming (LP) model to minimize the parts placement cost of a printed circuit board by determining the optimal combination of component mounting techniques while operating within severe constraints. There are two primary methods of placement available to printed circuit board manufacturers today: surface mount (SMD) and through-hole (THD). To rationally compare these two methods, it is assumed that engineers designing the PCB may choose either SMD or THD technology. Both production methods yield identical function, although the physical characteristics of comparable boards differ.
Barter, Archie M.; Lynam, Kurt; Makki, Shaker H.; Mayer, David S.; Rachwan, Agung; and Valceschini, Chuck R., "Printed Circuit Board Placement Cost Optimization" (1990). Engineering and Technology Management Student Projects. 366.