Advisor

Sung Yi

Date of Award

8-15-2018

Document Type

Thesis

Degree Name

Master of Science (M.S.) in Mechanical Engineering

Department

Mechanical Engineering

Physical Description

1 online resource (vii, 79 pages)

Abstract

Viscoelastic polymer materials are being actively considered as a novel material for semiconductor packaging applications as a result of their ability to develop strong adhesive bonds at lower temperatures. Viscoelastic thermoset materials are impacted by the stresses generated during the curing process, which is also accompanied by a dissipation of thermal energy. There is a need to develop a generic modeling formulation that is applicable to any material of interest in order to enable the study of different bonding materials and develop optimized curing cycles. This study reports a numerical formulation to evaluate the stress generated and energy dissipated during the cure of viscoelastic polymers. A generalized method to define the transient variation of degree of cure was developed using a 4th order Runge Kutta approximation. The mathematical formulation was implemented using a novel evaluation methodology that helped reduce the computational power requirement. The commercially-available 3501-6 resin was simulated as a characteristic material in this study. The numerical model was validated against analytically derived solutions for both a single Maxwell model, and a Generalized Maxwell Model (GMM) for cases of constant-strain inputs, and subsequently for sinusoidal strain inputs, wherein, material properties were considered to be constant or varying linearly with degree of cure. A good agreement was obtained between the present model and analytical solutions.

Persistent Identifier

https://archives.pdx.edu/ds/psu/26507

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