Strategic Management of Technology
Currently, the dynamic nature of the PCB manufacturing market situation, businesses will need to be more robust and flexible than they have been used to, in order to gain or even maintain their market competitiveness. We are known as Server.com Inc. are facing the increasing costs of manufacturing our own system boards that are becoming more complex and harder to integrate into our chassis that are also becoming smaller and smaller with each successive generation. Therefore, the ultimate objectives of this paper is to evaluate our own internal electrical needs, set those future electrical goals, and then translate them into the PCB characteristics that will need to be met by the High Density Interconnect (HDI) technologyof choice. We also will need to evaluate our external fabrication suppliers' capability to provide that technology with acceptable yields, which equates in to lower costs for us. Our final analysis results will represent the benefits and risks of each of the alternatives and the proposal for the best-fit alternative adding the preliminary plan for diffusing it throughout the organization.
Aunyakamol, Pakdee; Daim, Yonca; Gerdsri, Nathasit; and Platt, Richard, "Strategic Path to Convert Conventional PCB to High Density Interconnection" (2000). Engineering and Technology Management Student Projects. 2132.