An Introduction to Nanomaterials for Nanopackaging

Published In

IEEE Nanotechnology Magazine

Document Type

Citation

Publication Date

4-1-2024

Abstract

The multiple purposes of an electronics “package” include the provision of mechanical support to the silicon chip, for example, and protection from the environment, the delivery of power in and the facilitation of heat out, and the reliable input and output of information signals, whether electrical or optical. In the age of heterogeneous integration, this includes the internal conversion of signal modes between multiple technologies within the package, while maintaining the traditional requirement of reliable information transmission between packages, e.g., on a traditional circuit board. This article presents some selected examples of nanopackaging, i.e., the application of nanotechnologies, (nanoparticles, carbon nanotubes and graphene here,) to electronics packaging.

Rights

© Copyright 2024 IEEE - All rights reserved.

Description

James E. Morris is an Emeritus Professor...

DOI

10.1109/MNANO.2024.3358690

Persistent Identifier

https://archives.pdx.edu/ds/psu/41819

Publisher

IEEE

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