First Advisor

John Dash

Term of Graduation

Summer 1985

Date of Publication

6-21-1985

Document Type

Thesis

Degree Name

Master of Science (M.S.) in Physics

Department

Physics

Language

English

Subjects

Copper plating, Electromagnetic fields

DOI

10.15760/etd.5438

Physical Description

1 online resource (3, ix, 95 pages)

Abstract

The effect of a magnetic field on copper electrodeposition was investigated. Copper was electrodeposited onto square copper cathodes 1 sq cm in area from an aqueous solution (0.5 M CuSO4, 0.5 M H2SO4. A glass cell was placed between the pole pieces of an electromagnet, and the magnetic fields applied were in the range from 0 to 12.5 kG. The current density was in the range from 80 mA/sq cm to 880 mA/sq cm. In each of the experiments, cell current, cell voltage, and cell temperature were monitored with a microcomputer. The weight change, deposit surface and cross section morphology, and the hardness were also found. Anodes used in the experiments were studied to see the effect of various conditions on the surface finish. Copper was also electrodeposited onto copper grids in order to study how the uniformity of the deposit is affected by an applied magnetic field.

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Comments

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Persistent Identifier

https://archives.pdx.edu/ds/psu/20093

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