Document Type

Closed Project

Publication Date

Fall 2003


Dundar Kocaoglu

Course Title

Engineering and Technology Management

Course Number

EMGT 520/620


The largest Engineering Management challenge in the conversion from 200mm to 300mm wafer processing no longer lies within the cleanrooms of the fab plants themselves. Instead, the challenges are in establishing common interface standards between multiple vendors wafer handling, transportation and processing machinery. Especially between the FOUP (Front Opening Unified Pod) and processing machinery. In addition the Engineering Manager must integrate new designs for the buildings, material supply and infrastructure required into an optimum operating model.


This project is only available to students, staff, and faculty of Portland State University

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