Engineering and Technology Management
The largest Engineering Management challenge in the conversion from 200mm to 300mm wafer processing no longer lies within the cleanrooms of the fab plants themselves. Instead, the challenges are in establishing common interface standards between multiple vendors wafer handling, transportation and processing machinery. Especially between the FOUP (Front Opening Unified Pod) and processing machinery. In addition the Engineering Manager must integrate new designs for the buildings, material supply and infrastructure required into an optimum operating model.
Berking, Johannes; Brossard, Jim; Lertsathitphong, Kiatiphong; and Shinriki, Seiji, "Management and Engineering Challenges of Converting From 200mm to 300 mm Wafer Processing in the Electronic Microchip Fabrication Industry" (2003). Engineering and Technology Management Student Projects. 1373.