Document Type
Closed Project
Publication Date
Fall 2003
Instructor
Dundar Kocaoglu
Course Title
Engineering and Technology Management
Course Number
EMGT 520/620
Abstract
The largest Engineering Management challenge in the conversion from 200mm to 300mm wafer processing no longer lies within the cleanrooms of the fab plants themselves. Instead, the challenges are in establishing common interface standards between multiple vendors wafer handling, transportation and processing machinery. Especially between the FOUP (Front Opening Unified Pod) and processing machinery. In addition the Engineering Manager must integrate new designs for the buildings, material supply and infrastructure required into an optimum operating model.
Rights
In Copyright. URI: http://rightsstatements.org/vocab/InC/1.0/ This Item is protected by copyright and/or related rights. You are free to use this Item in any way that is permitted by the copyright and related rights legislation that applies to your use. For other uses you need to obtain permission from the rights-holder(s).
Persistent Identifier
http://archives.pdx.edu/ds/psu/23535
Citation Details
Berking, Johannes; Brossard, Jim; Lertsathitphong, Kiatiphong; and Shinriki, Seiji, "Management and Engineering Challenges of Converting From 200mm to 300 mm Wafer Processing in the Electronic Microchip Fabrication Industry" (2003). Engineering and Technology Management Student Projects. 1373.
http://archives.pdx.edu/ds/psu/23535
Comments
This project is only available to students, staff, and faculty of Portland State University