First Advisor

Sung Yi

Term of Graduation

Summer 2021

Date of Publication


Document Type


Degree Name

Master of Science (M.S.) in Mechanical Engineering


Mechanical and Materials Engineering




Materials -- Fatigue, Solder and soldering, Integrated circuits -- Reliability, Reliability (Engineering)



Physical Description

1 online resource (vi, 82 pages)


Accurate prediction of fatigue life of solder joints in electronic packaging applications becomes of critical importance as semiconductor device technology and manufacturing constraints grow in complexity. To gain visibility on IC device performance and reliability, thermo-mechanical simulation is performed based on a unified, viscoplastic material model, which is dependent on nine parameters.

In this study, an improved method of Anand parameter extraction, which involves curve-fitting non-linear experimental stress data, is proposed to improve the accuracy of numerical predictions for solder reliability. Theoretical equations for uni-axial stress-strain response and creep response are derived, then details on their relevance to experimental and numerical data is explained in detail. Numerical analysis is performed using the Finite-Element method, and both uni-axial and full-package representations are used to evaluate creep damage data.

Previous literature is reviewed, and sources of analytical and numerical error are discussed in comparison to similar work completed in both academia and industry. Finally, the widely used Coffin-Manson model is used to predict reliability using damage data obtained through a uni-axial tensile model, performed using Abaqus simulation software. It is found that in comparison to experimental stress-strain data, the proposed method of curve-fitting produces more accurate data, and the new parameters predict higher fatigue life for both the uni-axial tensile and full package models.


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