Electron Device Subjected to Temperature Cycling: Predicted Time-to-Failure
Journal of Electronic Materials
The Boltzmann–Arrhenius–Zhurkov constitutive equation is employed to assess the fatigue lifetime of a solder material subjected, during failure-oriented-accelerated-testing (FOAT), to temperature cycling and experiencing plastic deformations (low cycle fatigue condition). The damage caused by a single cycle is quantified, in accordance with Hall’s concept, by the hysteresis loop area of the inelastic strain energy. The suggested methodology is illustrated by a numerical example. It is shown how the operational lifetime of the material can be predicted from the FOAT data.
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