Title

Electron Device Subjected to Temperature Cycling: Predicted Time-to-Failure

Published In

Journal of Electronic Materials

Document Type

Citation

Publication Date

2-1-2019

Abstract

The Boltzmann–Arrhenius–Zhurkov constitutive equation is employed to assess the fatigue lifetime of a solder material subjected, during failure-oriented-accelerated-testing (FOAT), to temperature cycling and experiencing plastic deformations (low cycle fatigue condition). The damage caused by a single cycle is quantified, in accordance with Hall’s concept, by the hysteresis loop area of the inelastic strain energy. The suggested methodology is illustrated by a numerical example. It is shown how the operational lifetime of the material can be predicted from the FOAT data.

DOI

10.1007/s11664-018-06867-z

Persistent Identifier

https://archives.pdx.edu/ds/psu/27811

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