Title

Analytical Thermal Stress Modeling in Electronics and Photonics Engineering: Application of the Concept of Interfacial Compliance

Published In

Journal of Thermal Stresses

Document Type

Citation

Publication Date

2-1-2019

Abstract

Application of the concept of interfacial compliance in analytical thermal stress modeling in electronics and photonics engineering is addressed. The review is based mostly on the author’s research conducted during his tenure with Bell Labs (Basic Research, Area 11, Murray Hill, NJ), University of California (Santa Cruz, CA), Portland State University (Portland, OR), and Small-Business-Innovative-Research (SBIR) ERS Co. The emphasis is on practically important, but often non-obvious and sometime even paradoxical situations.

Description

Copyright © 2018 Informa UK Limited

DOI

10.1080/01495739.2018.1525331

Share

COinS