Physical Design for Reliability of Solder Joint Interconnections for Application in Aerospace Electronics
Published In
2019 IEEE 5th International Workshop on Metrology for Aerospace (metroaerospace)
Document Type
Citation
Publication Date
6-1-2019
Abstract
The problem and the challenge of the physical (mechanical) design for reliability of solder joint interconnections (SJIs) for aerospace electronics is addressed and some practically useful solutions to this problem are suggested and discussed in detail. The considered problem includes: 1) the possibility of avoiding inelastic strains in the solder material; 2) quantification, on the probabilistic basis, the expected lifetime of the SJI of interest; and 3) possible replacement of the temperature cycling accelerated testing with a more physically meaningful, less costly and less time- and labor consuming low-temperature/random-vibration bias. The general concepts are illustrated by numerical examples.
Locate the Document
DOI
10.1109/MetroAeroSpace.2019.8869658
Persistent Identifier
https://archives.pdx.edu/ds/psu/34627
Publisher
IEEE
Citation Details
Suhir, E., Yi, S., & Nicolics, J. (2019). Physical Design for Reliability of Solder Joint Interconnections for Application in Aerospace Electronics. Institute of Electrical and Electronics Engineers (IEEE). https://doi.org/10.1109/metroaerospace.2019.8869658