Title

Physical Design for Reliability of Solder Joint Interconnections for Application in Aerospace Electronics

Published In

2019 IEEE 5th International Workshop on Metrology for Aerospace (metroaerospace)

Document Type

Citation

Publication Date

6-1-2019

Abstract

The problem and the challenge of the physical (mechanical) design for reliability of solder joint interconnections (SJIs) for aerospace electronics is addressed and some practically useful solutions to this problem are suggested and discussed in detail. The considered problem includes: 1) the possibility of avoiding inelastic strains in the solder material; 2) quantification, on the probabilistic basis, the expected lifetime of the SJI of interest; and 3) possible replacement of the temperature cycling accelerated testing with a more physically meaningful, less costly and less time- and labor consuming low-temperature/random-vibration bias. The general concepts are illustrated by numerical examples.

DOI

10.1109/MetroAeroSpace.2019.8869658

Persistent Identifier

8869658

Publisher

IEEE

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