Portland State University. Department of Electrical and Computer Engineering
Date of Award
Doctor of Philosophy (Ph.D.) in Electrical and Computer Engineering
Electrical and Computer Engineering
1 online resource (237 p.)
Three-dimensional integrated circuits -- Design and construction, Integrated circuits -- Very large scale integration -- Computer-aided design, Semiconductor industry -- Technological innovations
We have developed a placement-aware 3-D floorplanning algorithm that enables additional wirelength reduction by planning for 3-D placement of logic gates in selected circuit modules during the floorplanning stage. Thus it also bridges the existing gap between 3-D floorplanning and 3-D placement. To reduce the solution space of 3-D floorplanning which is known to be an NP-hard problem, we derive a set of feasibility conditions on the topological representation of a floorplan. In addition, we have designed a fast module packing algorithm that satisfies a set of constraints for placement-aware 3-D floorplanning. Furthermore, we have designed an efficient evolutionary algorithm that is used in the proposed 3-D floorplanning algorithm for multi-objective combinatorial optimization. Our results show that the proposed placement-aware 3-D floorplanning algorithm is very fast, and it reduces the system level total wirelength by 9.8% compared to existing state-of-the-art floorplanning tools that do not plan for 3-D placement of floorplanning modules.
Nain, Rajeev Kumar, "Floorplan Design and Yield Enhancement of 3-D Integrated Circuits" (2011). Dissertations and Theses. Paper 2810.