First Advisor

Sung Yi

Date of Publication

Fall 1-16-2018

Document Type

Thesis

Degree Name

Master of Science (M.S.) in Mechanical Engineering

Department

Mechanical and Materials Engineering

Language

English

Subjects

Viscoplasticity -- Mathematical models, Solder and soldering, Joints (Engineering), Thermal stresses, Strains and stresses

DOI

10.15760/etd.5959

Physical Description

1 online resource (viii, 64 pages)

Abstract

Embedded active and passive devices has been increasingly used by in order to integrate more functions inside the same or smaller size device and to meet the need for better electrical performance of the component assemblies.

Solder joints have been used in the electronic industry as both structural and electrical interconnections between electronic packages and printed circuit boards (PCB). When solder joints are under thermal cyclic loading, mismatch in coefficients of thermal expansion (CTE) between the printed circuit boards and the solder balls creates thermal strains and stresses on the joints, which may finally result in cracking. Consequently, the mechanical interconnection is lost, leading to electrical failures which in turn causes malfunction of the circuit or whole system.

When a die is embedded into a substrate, Young's modulus of the die is larger than one of the core of the substrate and the CTEs of the die is smaller than those of the substrate. As a result, mismatch in coefficients of thermal expansions (CTE) between the substrate with the embedded device and the solder balls may increase.

In the present study, finite element method (FEM) is employed to find out the stress and strain distribution of ball grid array(BGA) solders under thermal cycling. The ANAND model for viscoplasticity is employed for this purpose.

Rights

In Copyright. URI: http://rightsstatements.org/vocab/InC/1.0/ This Item is protected by copyright and/or related rights. You are free to use this Item in any way that is permitted by the copyright and related rights legislation that applies to your use. For other uses you need to obtain permission from the rights-holder(s).

Persistent Identifier

http://archives.pdx.edu/ds/psu/23427

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