First Advisor

Sung Yi

Date of Publication

Summer 8-15-2018

Document Type

Thesis

Degree Name

Master of Science (M.S.) in Mechanical Engineering

Department

Mechanical Engineering

Language

English

Subjects

Viscoelastic materials -- Curing, Viscoelastic materials -- Curing -- Mathematical models, Viscoelasticity, Polymers

DOI

10.15760/etd.6422

Physical Description

1 online resource (vii, 79 pages)

Abstract

Viscoelastic polymer materials are being actively considered as a novel material for semiconductor packaging applications as a result of their ability to develop strong adhesive bonds at lower temperatures. Viscoelastic thermoset materials are impacted by the stresses generated during the curing process, which is also accompanied by a dissipation of thermal energy. There is a need to develop a generic modeling formulation that is applicable to any material of interest in order to enable the study of different bonding materials and develop optimized curing cycles. This study reports a numerical formulation to evaluate the stress generated and energy dissipated during the cure of viscoelastic polymers. A generalized method to define the transient variation of degree of cure was developed using a 4th order Runge Kutta approximation. The mathematical formulation was implemented using a novel evaluation methodology that helped reduce the computational power requirement. The commercially-available 3501-6 resin was simulated as a characteristic material in this study. The numerical model was validated against analytically derived solutions for both a single Maxwell model, and a Generalized Maxwell Model (GMM) for cases of constant-strain inputs, and subsequently for sinusoidal strain inputs, wherein, material properties were considered to be constant or varying linearly with degree of cure. A good agreement was obtained between the present model and analytical solutions.

Rights

In Copyright. URI: http://rightsstatements.org/vocab/InC/1.0/ This Item is protected by copyright and/or related rights. You are free to use this Item in any way that is permitted by the copyright and related rights legislation that applies to your use. For other uses you need to obtain permission from the rights-holder(s).

Persistent Identifier

https://archives.pdx.edu/ds/psu/26507

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