Could Dynamic Strength of a Bonding Material in an Electronic Device be Assessed from Static Shear-Off Test Data?

Authors

Ephraim Suhir, Portland State UniversityFollow
James E. Morris, Portland State University
Liang Wang, Portland State University
Sung Yi, Portland State UniversityFollow

Published In

Journal of Materials Science: Materials in Electronics

Document Type

Citation

Publication Date

3-11-2016

Abstract

A simple and physically meaningful analytical predictive model is suggested to estimate the ultimate drop height in drop tests from the shear-off test data. The incentive for such an effort is due to the fact that shear-off tests are much easier to design, organize and conduct than drop tests. The analysis is limited to elastic stresses. The general concept is illustrated by a numerical example.

Locate the Document

http://dx.doi.org/10.1007/s10854-016-4617-z

DOI

10.1007/s10854-016-4617-z

Persistent Identifier

http://archives.pdx.edu/ds/psu/18915

Citation Details

Suhir, E., Morris, J. E., Wang, L., & Yi, S. (2016). Could dynamic strength of a bonding material in an electronic device be assessed from static shear-off test data? Journal of Materials Science: Materials in Electronics,27(7), 6697–6702. http://doi.org/10.1007/s10854-016-4617-z