Could Dynamic Strength of a Bonding Material in an Electronic Device be Assessed from Static Shear-Off Test Data?
Journal of Materials Science: Materials in Electronics
A simple and physically meaningful analytical predictive model is suggested to estimate the ultimate drop height in drop tests from the shear-off test data. The incentive for such an effort is due to the fact that shear-off tests are much easier to design, organize and conduct than drop tests. The analysis is limited to elastic stresses. The general concept is illustrated by a numerical example.
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Suhir, E., Morris, J. E., Wang, L., & Yi, S. (2016). Could dynamic strength of a bonding material in an electronic device be assessed from static shear-off test data? Journal of Materials Science: Materials in Electronics,27(7), 6697–6702. http://doi.org/10.1007/s10854-016-4617-z