Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance

Authors

Tae-Kyu Lee, Portland State UniversityFollow
Zhiqiang Chen, Portland State University
Greg Baty, Portland State UniversityFollow
Thomas R. Bieler, Michigan State University
Choong-Un Kim, University of TexasFollow

Published In

Journal of Electronic Materials

Document Type

Citation

Publication Date

12-1-2016

Abstract

The mechanical stability of Sn-Ag-Cu interconnects with low and high silver content against mechanical shock at room and elevated temperatures was investigated. With a heating element-embedded printed circuit board design, a test temperature from room temperature to 80°C was established. High impact shock tests were applied to isothermally pre-conditioned ball-grid array interconnects. Under cyclic shock testing, degradation and improved shock performances were identified associated with test temperature variation and non-solder mask defined and solder-mask defined pad design configuration differences. Different crack propagation paths were observed, induced by the effect of the elevated temperature test conditions and isothermal aging pre-conditions.

Locate the Document

https://doi.org/10.1007/s11664-016-4902-x

DOI

10.1007/s11664-016-4902-x

Persistent Identifier

http://archives.pdx.edu/ds/psu/19392

Citation Details

Lee, T. K., Chen, Z., Baty, G., Bieler, T. R., & Kim, C. U. (2016). Impact of an Elevated Temperature Environment on Sn-Ag-Cu Interconnect Board Level High-G Mechanical Shock Performance. Journal of Electronic Materials, 45(12), 6177-6183.