Simulation Studies of Sn-based Perovskites with Cu back-contact for Non-toxic and Non-corrosive Devices

Authors

Saquib Ahmed, SUNY – Buffalo StateFollow
Jalen Harris, California State University
Jon Shaffer, SUNY – Buffalo StateFollow
Mohan Devgun, SUNY – Buffalo State
Shaestagir Chowdhury, Portland State UniversityFollow
Aboubakr Abdullah, Qatar University
Sankha Banerjee, California State UniversityFollow

Published In

Journal of Materials Research

Document Type

Citation

Publication Date

8-28-2019

Abstract

Using general-purpose photovoltaic device model, we have simulated the operation and functionality of a working Sn perovskite/Cu2O hole transport layer (HTL)/Cu back-contact device versus a standard Pb perovskite/Spiro HTL/Ag back-contact device. The results are extremely promising in that they showcase comparable cell efficiencies, with the Sn perovskite/Cu2O HTL/Cu back-contact device showing a highest 22.9% efficiency [Jsc of 353.4 A/m2, Voc of 0.84 V, fill factor (FF) of 0.77] at 427 nm active layer thickness compared with 24.6% of the standard Pb perovskite/Spiro HTL/Ag back-contact device (Jsc of 356.8 A/m2, Voc of 0.82 V, FF of 0.84) at the same active layer thickness. Jsc, Voc, and FF kinetics reveal that the Sn perovskite/Cu2O HTL/Cu back-contact device can perform better by reducing the recombination centers both within each layer matrix and in the interfacial contacts.

Description

COPYRIGHT: © Materials Research Society 2019

Locate the Document

http://doi.org/10.1557/jmr.2019.204

DOI

10.1557/jmr.2019.204

Persistent Identifier

https://archives.pdx.edu/ds/psu/30112

Citation Details

Ahmed, S., Harris, J., Shaffer, J., Devgun, M., Chowdhury, S., Abdullah, A., & Banerjee, S. (2019). Simulation studies of Sn-based perovskites with Cu back-contact for non-toxic and non-corrosive devices. Journal of Materials Research, 34(16), 2789-2795.