The Role of a Nonconductive Film (NCF) on Cu/ni/sn-Ag Microbump Interconnect Reliability
Published In
Journal of Materials Science-Materials in Electronics
Document Type
Citation
Publication Date
8-11-2020
Locate the Document
DOI
10.1007/s10854-020-04115-x
Persistent Identifier
https://archives.pdx.edu/ds/psu/34665
Citation Details
Ryu, H., Son, K., Han, J. S., Park, Y.-B., & Lee, T.-K. (2020). The role of a nonconductive film (NCF) on Cu/Ni/Sn-Ag microbump interconnect reliability. Journal of Materials Science: Materials in Electronics. https://doi.org/10.1007/S10854-020-04115-X