Title

The Role of a Nonconductive Film (NCF) on Cu/ni/sn-Ag Microbump Interconnect Reliability

Published In

Journal of Materials Science-Materials in Electronics

Document Type

Citation

Publication Date

8-11-2020

DOI

10.1007/s10854-020-04115-x

Persistent Identifier

https://archives.pdx.edu/ds/psu/34665

Share

COinS