Localized Multi-Axis Loading Impact on Interconnect Thermal Cycling Performance in Via-In-Pad Plated over (VIPPO) Board Configuration

Authors

Mohamed Sheikh, Portland State University
Andy Hsiao, Portland State University
Weidong XieFollow
Steven Perng
Tae-Kyu Lee, Portland State UniversityFollow

Published In

Journal of Electronic Materials

Document Type

Citation

Publication Date

8-27-2020

Locate the Document

https://doi.org/10.1007/s11664-020-08409-y

DOI

10.1007/s11664-020-08409-y

Persistent Identifier

https://archives.pdx.edu/ds/psu/34667

Citation Details

Sheikh, M., Hsiao, A., Xie, W., Perng, S., & Lee, T.-K. (2020). Localized Multi-axis Loading Impact on Interconnect Thermal Cycling Performance in Via-in-Pad Plated Over (VIPPO) Board Configuration. Journal of Electronic Materials. https://doi.org/10.1007/s11664-020-08409-y