Title

Localized Multi-Axis Loading Impact on Interconnect Thermal Cycling Performance in Via-In-Pad Plated over (VIPPO) Board Configuration

Published In

Journal of Electronic Materials

Document Type

Citation

Publication Date

8-27-2020

DOI

10.1007/s11664-020-08409-y

Persistent Identifier

https://archives.pdx.edu/ds/psu/34667

Share

COinS