Moisture Sensitivity Plastic Packages of IC Devices

Authors

Xuejun Fan, Lamar University
Ephraim Suhir, Portland State UniversityFollow

Document Type

Book

Publication Date

2010

Abstract

Volume edited by Fan and Suhir: Presented in a systematic manner based on lectures and tutorials by the authors; Focused on improved reliability in plastic packaging; Provides theory and new industry applications

Rights

© Springer

DOI

10.1007/978-1-4419-5719-1

Persistent Identifier

https://archives.pdx.edu/ds/psu/40407

Citation Details

Fan X. J. & Suhir E. (2010). Moisture Sensitivity Plastic Packages of IC Devices. Springer.