Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

Authors

Ephraim Suhir, Portland State UniversityFollow

ISBN

9781138624733

Document Type

Book

Publication Date

2021

Subjects

Failure analysis (Engineering), Interconnects (Integrated circuit technology) -- Protection, Solder and soldering -- Mechanical properties -- Mathematical models

Abstract

"The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime. It helps the reader predict and minimize, at the design stage and using analytical modeling concepts and approaches, the stresses and strains in solder joint interconnects of IC devices" -- Provided by publisher

Rights

© CRC Press

Locate the Document

PSU Affiliates:
Print Book (PSU Library Catalog)

Non-affiliates:
WorldCat Record (Request via your local interlibrary loan service.)

Persistent Identifier

https://archives.pdx.edu/ds/psu/40408

Citation Details

Suhir E. (2021). Avoiding inelastic strains in solder joint interconnections of IC devices (First). CRC Press.