Sponsor
This research was supported by Korean Institute for Advancement of Technology (KIAT) grant funded by the Korea Government(MOTIE) (RS-2024–00435406, Human Resource Development Program for Industrial Innovation (Global))
Published In
Results in Materials
Document Type
Article
Publication Date
11-23-2025
Subjects
Uni-directional pores, Lotus-type porous Cu, Soldering, Void formation -- Shear strength
Abstract
Void formation in solder joints is a critical reliability challenge in high-power electronics, as it degrades thermal dissipation and mechanical integrity. This study investigates a novel structural approach to mitigate this issue. The influence of an uni-directional porous structure in lotus-type porous Cu (Louts Cu) on void formation in solder joints was investigated. All pores in lotus Cu were infiltrated with SAC305 (Sn–3.0Ag–0.5Cu) solder paste. Then reflow soldering was performed under three different atmospheric conditions: air, nitrogen, and vacuum. The microstructure and void fraction were characterized. The shear strength was evaluated. The shear strength of Louts Cu joint was slightly higher than that of non-porous Cu joint. The characterization of void fraction in joints exhibited that lotus Cu joint is lower than that of non-porous Cu joint.
Rights
Copyright (c) 2025 The Authors
This work is licensed under a Creative Commons Attribution 4.0 International License.
DOI
10.1016/j.rinma.2025.100827
Persistent Identifier
https://archives.pdx.edu/ds/psu/44283
Publisher
Elsevier BV
Citation Details
Lee, J.-K., Kim, K.-S., Shin, J.-H., Cho, S.-M., Yi, S., Kim, S.-W., & Hyun, S.-K. (2025). Effect of pore structure on void formation in lotus type porous Cu/solder joints. Results in Materials, 28, 100827.