Published In

Journal of Materials Science: Materials in Electronics

Document Type

Article

Publication Date

3-2016

Subjects

Ball grid array technology, Optical materials -- Technological innovations, Microelectronic packaging -- Materials

Abstract

There is an obvious incentive for using bow-free (temperature change insensitive) assemblies in various areas of engineering, including electron device and electronic packaging fields. The induced stresses in a bow-free assembly could be, however, rather high, considerably higher than in an assembly, whose bow is not restricted. The simplest and trivial case of a bow-free assembly is a tri-component body, in which the inner component is sandwiched between two identical outer components (“mirror” structure), is addressed in our analysis, and a simple and physically meaningful analytical stress model is suggested. It is concluded that if acceptable stresses (below yield stress of the solder material) are achievable, a mirror (bow-free, temperature-change-insensitive) design should be preferred, because it results in an operationally stable performance of the system.

Description

This work was authored as part of the Contributor's official duties as an Employee of the United States Government and is therefore a work of the United States Government. In accordance with 17 U.S.C. 105, no copyright protection is available for such works under U.S. Law. This is the publisher’s final pdf. The published article is copyrighted by Springer Science+Business Media and can be found at: http://dx.doi.org/10.1007/s10854-015-4042-8

DOI

10.1007/s10854-015-4042-8

Persistent Identifier

http://archives.pdx.edu/ds/psu/17012

Download

Share

COinS