Journal of Materials Science: Materials in Electronics
Ball grid array technology, Optical materials -- Technological innovations, Microelectronic packaging -- Materials
There is an obvious incentive for using bow-free (temperature change insensitive) assemblies in various areas of engineering, including electron device and electronic packaging fields. The induced stresses in a bow-free assembly could be, however, rather high, considerably higher than in an assembly, whose bow is not restricted. The simplest and trivial case of a bow-free assembly is a tri-component body, in which the inner component is sandwiched between two identical outer components (“mirror” structure), is addressed in our analysis, and a simple and physically meaningful analytical stress model is suggested. It is concluded that if acceptable stresses (below yield stress of the solder material) are achievable, a mirror (bow-free, temperature-change-insensitive) design should be preferred, because it results in an operationally stable performance of the system.
Suhir, E., Ghaffarian, R., and Nicolics, J. (2016). Predicted Stresses in Ball-Grid-Array (BGA) and Column-Grid-Array (CGA) Interconnections in a Mirror-Like Package Design. Journal of Materials Science: Materials in Electronics, Volume 27, Issue 3, pp 2430-2441.